Engineer desoldering machine case SDK-20P

Body size: 210 x 165mm/Body weight: 420g Power supply: AC100V/50/60Hz Pump: Diaphragm type/Motor output: 12W Ultimate vacuum: 86Kpa (650mmHg)/Time to reach maximum pressure: 0.2 seconds Displacement (OPEN): 15L /min Heater: Ceramic with built-in 100W sensor/Control method: Feedback zero cross method Set temperature: 350℃~500℃ (continuously variable)/Insulation resistance: 100MΩ or more (400℃) Maximum hot air discharge temperature: 400℃/Tip (hole diameter): 1.0φ Power cord: 3P cord (ground type) 1.8m Set contents: Main unit (hole diameter φ1.0 tip), 1 spare filter cartridge, cleaning pin, 2P-3P conversion plug Increase the number of displayed items

A new affordable, low-priced version of the popular desoldering machine with a simple package is now available. Since the pump and suction nozzle are directly connected, it achieves quick vacuum attainment time and instant powerful suction (vacuum attainment level 650mmHg). It uses a high power (100V/100W) large capacity ceramic heater, making it ideal for removing solder from multilayer boards (4 to 8 layers). The mechanical part has a floating structure, achieving even lower vibration and noise. You can also remove SMD parts by operating the hot air switching lever and using the dedicated hot air nozzle. ●SD-20 case


Brand: ‎ENGINEER
Product model number: ‎SDK-20P
Package size: ‎25.6 x 25.2 x 7.4 cm; 439.98 g
Color: ‎SDK-20P: Dedicated case
Name on nameplate: ‎SDK-20P: Dedicated case for desoldering machine
Product weight: 440 g